Source: H3C |Original Link
Recently, H3C Group, a subsidiary of Unisplendor Corporation, in collaboration with industry partners including Kylinsoft, Dameng Data, and Newcapec, launched an integrated Xinchuang solution for campus smart cards. This solution establishes a fully domestic technology stack spanning chip computing power, hardware platforms, operating systems, databases, and upper-layer applications. Through comprehensive end-to-end adaptation and optimization, it sets a new benchmark for standardized, high-performance, and autonomous smart campus card systems based on domestic innovation.
Designed specifically for Xinchuang scenarios in the education sector, this integrated campus smart card solution features full-stack integration and autonomous reliability as its core advantages, providing one-stop support for comprehensive smart campus development. In terms of full-stack integration, the solution incorporates key capabilities such as multi-medium unified identity authentication, the Xingpu large model, campus AI assistants, aggregated payment across all domains, online self-service payment, unified financial settlement, and comprehensive equipment O&M. It covers diverse business areas including campus consumption and payments, security access control, and utility management, meeting the digitalization requirements of university management across all scenarios. Regarding autonomous reliability, the solution implements a five-tier protection architecture that integrates chip-level native security, operating system security mechanisms, database security policies, network security defenses, and application security systems to establish a complete end-to-end security closed loop. Furthermore, to accommodate institutions of varying sizes, the solution offers three standardized configuration tiers, supporting flexible selection and procurement based on specific needs to enable rapid deployment and immediate usability.
The core of this five-party collaboration lies in deep technical service integration. H3C has established a joint expert panel with four industry partners to complete full-stack system optimization and will provide unified joint technical services to university clients, collectively mitigating technical risks throughout the entire project lifecycle. Universities will receive not merely a collection of disparate products, but an integrated service guarantee jointly endorsed by the reputation of all five parties. This Five-in-One model encompasses five dimensions: solutions, sales systems, ecosystem alliances, marketing systems, and service systems, achieving full-chain coordination from product delivery and market promotion to after-sales operations and maintenance.
Consolidating the Foundation for Full-Stack Domestic Innovation in Education through Full-Stack Synergy
As the core hardware platform provider and integration optimizer for this solution, H3C fully leverages its full-stack technological synergy across six major domains: computing, networking, storage, cloud, security, and O&M. Within the five-layer full-stack domestic technology architecture constructed for this solution, H3C plays a pivotal role ranging from underlying computing power to hardware platforms, and from network connectivity to system integration, ensuring deep collaboration and optimal performance among vendors at every level.
Guided by the Computing Power × Connectivity technology philosophy, H3C provides a robust hardware foundation and network support for the solution. In terms of computing power, H3C's diverse heterogeneous computing supply and efficient scheduling capabilities deliver substantial computing resources to ensure high-concurrency and highly reliable operation of the campus smart card system. Regarding network connectivity, H3C utilizes high-bandwidth, low-latency products and solutions to guarantee high-speed data transmission and stable interconnection across diverse business scenarios, including campus consumption and payments, security access control, and utility management.
Deepening Engagement in Education: H3C Leads the Industry with Full-Stack Capabilities
As a practitioner and leader in educational digitalization, H3C Group has long been deeply engaged in the education and scientific research sectors. To date, H3C has served over 2,600 higher education institutions and research organizations nationwide, achieving 100% coverage of Double First-Class universities and providing top-level smart campus planning services for more than 40 prestigious institutions, including Tsinghua University and Peking University. In the basic education sector, H3C's primary and secondary school campus solutions have been deployed in over 80,000 schools across the country.
Leveraging its Computing Power × Connectivity technology and One Core, Two Wings strategy, H3C continues to drive the deep integration of AI technologies and Xinchuang solutions with educational and scientific research business scenarios. Marking a new starting point for Xinchuang in education, H3C will join hands with co-launching partners to initiate a joint marketing campaign. Industry-themed events are scheduled for the second half of 2026, accompanied by regional roadshows in key provinces nationwide. Concurrently, a lead-sharing and joint service system will be established to provide comprehensive support for centralized education procurement projects and renovation initiatives at key universities. The first batch of benchmark cases is currently underway and is expected to be officially implemented in the fourth quarter of 2026.
H3C will continue to capitalize on the multiplier effect of Computing Power × Connectivity, collaborating with industry partners to deepen engagement in the education Xinchuang sector. By leveraging full-stack domestic innovation capabilities, H3C aims to advance smart campus development from mere usability to superior user experience, injecting stronger technological momentum into the digital transformation of China's education system.