Source: Guoxin Jingyuan |Original Link

Against the backdrop of an explosion in intelligent technology and transformative industrial upgrading, on July 11, 2025, New Unigroup Group marked the third anniversary of its strategic restructuring by delivering a robust performance report: achieving annual revenue exceeding RMB 100 billion for three consecutive years; increasing cumulative patent applications by 25% to over 30,000; winning the National Science and Technology Progress Award twice; and leading dozens of industry-leading member companies—including Unisplendor Corporation, Unigroup Guoxin, UNISOC, and H3C—in continuous breakthroughs, the launch of more than ten major innovative products, and comprehensive expansion across both domestic and international markets.

Behind these substantial achievements over the past three years lies New Unigroup Group's focus on its core intelligent technology business. Driven by a multi-dimensional strategy integrating strategic planning, technological breakthroughs, and ecosystem synergy, the Group has accelerated its transformation from restructuring to reconstruction, establishing a new paradigm and pathway for China's high-tech industry as it advances from technological evolution to developmental leap.

Focusing on Core Business and Strategic Planning to Strengthen, Supplement, and Extend the Industrial Chain

Transitioning from a model of broad diversification to one of focused strength, New Unigroup Group has concentrated on its core intelligent technology business, organized operations into eight major sectors, and established a governance framework comprising three headquarters—Business Headquarters, Empowerment Headquarters, and Management Headquarters—to facilitate resource synergy and accelerate development across its more than 200 subsidiaries.

In terms of strategic planning, New Unigroup Group has integrated with dozens of technology companies controlled by its shareholders to form the New Unigroup Ecosystem. This ecosystem encompasses a complete semiconductor industry chain covering chip design, packaging and testing, equipment, materials, and modules, as well as a comprehensive digital economy ecosystem spanning ICT equipment, cloud services, and digital solutions. With a vast industrial portfolio that includes over 30 production bases worldwide, branches in more than 60 countries and regions, and products and services available in over 100 countries and regions, the Group effectively supports the global commercialization of new technologies and the deployment of new products.

Regarding new businesses and projects, New Unigroup Group has further strengthened, supplemented, and extended its industrial chain while reinforcing its role as an industry leader. The Group has successively established new entities such as Unigroup Zhixing, Unigroup Smart Computing, Unigroup Shanxin, and New Unigroup Semiconductor. Additionally, it is planning and constructing R&D centers, intelligent manufacturing bases, advanced module production lines, and Chiplet advanced packaging lines in multiple locations to foster an innovation closed loop encompassing technology R&D, mass production, and application deployment.

Technological Breakthroughs and Frontier Exploration Driving Disruptive Innovation

Amid the surging tide of scientific revolution and industrial transformation, New Unigroup Group has established the Frontier Technology Research Institute to identify innovation breakthroughs with forward-looking vision. The Group continues to pursue key advancements in critical fields such as artificial intelligence, automotive electronics, mobile communications, and the low-altitude economy, thereby catalyzing a fission effect of innovation.

Artificial Intelligence

In this domain, New Unigroup Group has coordinated its subsidiaries to establish a collaborative matrix characterized by horizontal integration and vertical connectivity:

  • In the chip sector, the Group is closing the gap with international benchmarks through architectural innovations such as 3D stacking SeDRAM® technology and compute-in-memory architectures; in edge AI, it is enhancing energy efficiency and real-time responsiveness via platform-based solutions, lightweight model optimization, and edge-cloud collaboration;
  • In the intelligent computing sector, the Group has launched proprietary high-performance servers and storage systems with industry-leading performance metrics; in the intelligent connectivity sector, it has developed next-generation switches and routers featuring higher bandwidth and enhanced security protection.
  • In the field of Cloud and AI integration, New Unigroup lowers the barriers to enterprise intelligent transformation through "Inclusive AI + Knowledge Empowerment." In collaboration with industry chain partners, the Group has developed deeply integrated solutions coupling "Computing Power, Algorithms, and Governance" to accelerate the adoption of AI applications across vertical sectors. Currently, AI products and services from the New Unigroup ecosystem have been successfully deployed in numerous fields, including healthcare, government affairs, transportation, and education.

Automotive Electronics

In this sector, New Unigroup Group actively coordinates innovation and synergy among its member companies, achieving comprehensive coverage of automotive computing, control, storage, sensing, and power electronics. As one of the most comprehensively positioned groups in China's automotive chip landscape, the Group continues to achieve significant milestones with various innovative products and solutions:

  • Launched the THA6 series, China's first high-end automotive-grade MCU for powertrain domains certified to ASIL-D standards. This industry-leading product has entered mass production and has been adopted in vehicle models by numerous renowned OEMs and Tier 1 suppliers;
  • Released a flagship intelligent cockpit SoC based on advanced 6nm process technology, featuring high-performance CPU and AI computing capabilities, which has been adopted in mass-produced models by prominent brands such as SAIC Motor;
  • Leading products—including automotive security chips, automotive-grade LPDDR4, in-vehicle FPGAs, sensors, crystal oscillators, and power semiconductors—continue to achieve breakthroughs and iterative upgrades. These advancements collectively facilitate cross-domain technology sharing and cross-device scenario integration within the New Unigroup ecosystem, safeguarding the "chip-powered" future of the automotive industry.

Mobile Communications

In this field, New Unigroup Group consistently remains at the forefront of emerging technological trends:

  • Actively driving the implementation of pioneering technologies, including 5G New Calling, the freezing (finalization) of the R18 standard, Low Earth Orbit (LEO) satellite communications, and integrated space-ground networks;
  • Furthermore, the Group has taken a proactive lead in 6G strategic planning and actively participates in the formulation of national standards. Extensive research has been conducted in areas such as air interface transmission, Wireless AI, Integrated Sensing and Communication (ISAC), Passive IoT, Full Duplex, and Terahertz communication. Research outcomes have been published on multiple influential platforms, including IMT-2030, leveraging robust technological innovation to redefine future connectivity.

Low-Altitude Economy

In this sector, New Unigroup Group is strategically positioning itself within this trillion-level industry:

  • Launched customized solutions for unmanned aerial vehicles (UAVs), providing a full-stack software and hardware package comprising "Hangar + UAV + Autonomous Flight Control Platform." This solution fully satisfies diverse application requirements, including unattended operations, automated takeoff and landing, automatic charging, autonomous inspection, real-time HD video transmission, and data acquisition and analysis;
  • These solutions are currently widely deployed in sectors such as public security and railway inspection.

Openness, Win-Win Cooperation, and Global Collaboration: Integrating into the Broader Industrial Ecosystem

Amid the historic opportunity presented by the profound restructuring of global industrial chains, New Unigroup Group has consistently upheld the philosophy of openness and mutual benefit. By fully integrating into the broader industrial ecosystem and continuously expanding its network of partnerships, the Group ensures that innovation serves as a positive driver for accelerated advancement through industrial integration and mutual promotion.

In terms of industrial synergy, New Unigroup Group is comprehensively exploring new models of industrial chain coordination:

  • The Group has established a top-level strategic partnership with FAW Group to create an industry benchmark for "Chip + Automotive" integration;
  • Collaborations with numerous universities, including Zhejiang University, University of Science and Technology Beijing, and Tianjin University, are advancing deep industry-academia-research cooperation and achieving new breakthroughs in key technology R&D and commercialization.

Regarding global cooperation, New Unigroup Group, together with its leading member companies such as H3C, UNISOC, and Tongxin Microelectronics, leverages cross-regional collaboration networks and ecosystem aggregation capabilities to write a new chapter of "Chinese Technology, Global Value."

  • H3C has launched over 100 products exclusively for overseas markets, developed more than 3,000 certified partners, and extended its business coverage to over 100 countries and regions;
  • UNISOC's field testing covers more than 140 countries and regions, and it has obtained certifications from over 270 operators worldwide, further enhancing its global influence;
  • Tongxin Microelectronics has established a business presence in over 100 countries and regions across Asia, Europe, the Americas, and Africa, with cumulative shipments exceeding 25 billion units, thereby creating a second growth curve.

The substantial development potential of New Unigroup's portfolio companies has also received a positive response from capital markets:

  • Unisplendor Corporation has initiated a dual listing on the A-share and H-share markets to deepen its global strategic layout;
  • Unigroup Guoxin has been successfully listed on the NEEQ and admitted to the Innovation Tier, embarking on a new journey of accelerated development;
  • UNISOC and other member companies have secured continued capital commitments from top-tier investment institutions, accelerating their IPO processes.

This positive feedback from the capital markets reflects strong confidence in the future of China's technology sector and serves as a definitive endorsement of New Unigroup's development achievements.

Past achievements serve as a prologue to future endeavors. The third anniversary marks both a milestone in the development of New Unigroup Group and the starting point of a new journey. Amid the surging tide of intelligent technology, New Unigroup Group will remain committed to innovation and transformation, forging ahead with determination. By deepening collaboration with partners across all sectors, the Group will maintain its leading position and steadfast strategic direction in a dynamic market environment, illuminating every corner of the future with the light of technology.

As a globally competitive intelligent technology industrial group, New Unigroup Group has established a comprehensive digital economy ecosystem spanning chips and semiconductors, ICT equipment, cloud services, and digital solutions. Looking ahead, New Unigroup Group will uphold the Values of 'Aiming High, Going Far, and Creating Value,' working alongside partners to illuminate a better life through technology and make the world smarter, more open, more equitable, and more prosperous.