Source: UNICLOUD |Original Link
From November 20 to 21, 2025, the annual flagship event of the integrated circuit industry—the 2025 Integrated Circuit Development Forum (Chengdu-Chongqing) and the 31st Integrated Circuit Design Industry Exhibition (ICCAD-Expo 2025)—was successfully held at the China Western International Expo City. The conference established a platform for communication and collaboration among enterprises across all segments of the integrated circuit supply chain, specifically facilitating exchanges in technology, market development, applications, and investment for IC design firms. The event attracted over 8,000 industry experts and more than 2,000 IC companies to discuss new pathways for the high-quality development of the integrated circuit industry.
On the occasion of this industry summit, UNICLOUD officially launched its Zhixin Semiconductor Solution tailored for the full chip design workflow. Through booth exhibitions, strategic exchange meetings, and forum presentations, UNICLOUD engaged in in-depth discussions with clients, comprehensively showcasing its latest technological breakthroughs and practical achievements in intelligent IC design. Notably, the Tiangong All-in-One Machine and the Zhixin Semiconductor Solution made their public debut, becoming the focal point of the exhibition and attracting widespread attention.
Intelligently Ushering in a New Era of Chips
Debut of the UNICLOUD Zhixin Full-Process Semiconductor Solution
As the core highlight of the exhibition, UNICLOUD publicly unveiled the Tiangong All-in-One Machine and the Zhixin Semiconductor Solution for the first time, marking a critical step forward in promoting intelligence, automation, and efficiency in chip design.
The Tiangong All-in-One Machine creates a one-stop intelligent workstation focused on smart chip design, providing comprehensive coverage of the entire workflow from early-stage planning and mid-stage implementation to late-stage verification.
The Zhixin Semiconductor Solution provides end-to-end fully automated capabilities, encompassing project management, R&D process control, resource scheduler integration, and computing power management. It supports ultra-large-scale clusters, capable of efficiently managing hundreds of thousands of core-level nodes and achieving precise scheduling of millions of high-concurrency jobs. By deeply integrating R&D workflows with AI tools, the solution significantly enhances PPA optimization, driving dual improvements in both the efficiency and quality of chip design.
Advancing Together through Collaboration
UNICLOUD Partners with Hundreds of IC Enterprises to Foster Development
On the evening of November 19, under the theme "Advancing Together, Creating Shared Value," UNICLOUD hosted the UNICLOUD Zhixin Semiconductor Strategic Exchange Dinner. Representatives from over 100 benchmark enterprises in the IC design sector gathered to discuss industry trends and explore synergistic development.
At the dinner, Wang Yanping, President of UNICLOUD, delivered an address. He noted that global chip design is accelerating toward a new phase characterized by the deep integration of 5G and artificial intelligence, while Chinese IC design enterprises continue to face systemic challenges, including high dependence on core technologies, rising R&D costs, increasingly complex workflows, and a shortage of high-end talent. Against this backdrop, leveraging New Unigroup Group's long-standing accumulation in the semiconductor sector and its own innovative capabilities in digital technologies such as AI and cloud computing, UNICLOUD has introduced the Zhixin Semiconductor Solution. Focused on intelligent and scenario-based upgrades throughout the design workflow, the solution establishes four core capability systems: a full-process design platform, AI-empowered design, intelligent scheduling of simulation computing power, and professional consulting services. It aims to effectively lower design barriers, enhance R&D efficiency, optimize resource utilization, and strengthen the competitiveness and success rate of domestic chips.
Liu Yunfeng, Vice President of UNICLOUD and President of the Marketing Department, presented a live demonstration of the Zhixin Semiconductor Solution. He stated: "The first public unveiling of 'Zhixin' marks a pivotal step for UNICLOUD in transitioning from technological accumulation to industrial empowerment. It embodies our years of exploration at the intersection of chips and AI, and reflects our profound understanding of technological self-reliance and collaborative supply chain development. We firmly believe that only by adhering to an open ecosystem and deep collaboration can we forge industry-grade solutions that truly withstand the test of the market and time." He called upon more partners to join this collaborative effort to jointly define the next-generation chip design paradigm and propel China's integrated circuit industry toward a new stage of high-quality development.
Driving Innovation in Chip Design
UNICLOUD Reshapes the Full IC Workflow
At the IC Design and Innovative Application Sub-forum held on November 21, Geng Jiashen, Chief Architect of UNISOC Semiconductor Solutions, stated that UNICLOUD has reinvented the chip design workflow. He introduced an integrated AI-plus-chip-design platform tailored for the entire IC design process, which for the first time deeply integrates project management, design workflows, cluster scheduling, and intelligent optimization. This solution achieves end-to-end integration across front-end, mid-end, and back-end chip design processes alongside comprehensive project lifecycle management. Equipped with three core engines—AI-driven parameter optimization, rapid physical implementation assessment, and intelligent verification—the platform reduces traditional evaluation cycles from over ten days to just a few days while increasing resource utilization by more than 50%.
The UNISOC Semiconductor Solution is built upon a holistic architecture comprising Four Practices, Two Platforms, and One Foundation. The Four Practices include: Integrated Management and Design, enabling full project lifecycle management and standardized design workflows; AI-Empowered IC Development, leveraging EDA-plus-AI technologies to achieve intelligent parameter optimization, physical feasibility assessment, and knowledge base accumulation; Converged Cluster Management and Scheduling, establishing a computing power management system coordinated between the CAD management platform and the UNISOC Scheduler to support comprehensive monitoring, visual configuration, and high-performance job scheduling; and Consulting and Tuning Services, providing one-stop professional services ranging from process and flow optimization to expert diagnostics and back-end design support. The Two Platforms consist of the Chip Design Platform plus AI and the Cluster Computing Power Management Platform, jointly supporting upper-layer applications. The underlying Foundation relies on a hybrid computing infrastructure combining elastic public cloud resources with dedicated private cloud capacity, delivering an efficient, flexible, and reliable full-process digital support system for chip design enterprises.
Adhering to the philosophy of Easy Cloud Adoption, Effective Data Utilization, and Comprehensive Intelligence Empowerment, UNICLOUD leverages extensive expertise and practical experience in IC design to provide robust support for the high-quality development of the integrated circuit industry. Looking ahead, UNICLOUD will center its strategy on the full-stack UNISOC Semiconductor Solution to build a unified collaborative management platform. This initiative aims to eliminate collaboration barriers among R&D engineers, project managers, and IT/CAD operations teams, achieving seamless end-to-end connectivity throughout the chip design lifecycle from requirements to delivery. This represents not only a technological architecture upgrade but also a profound commitment to advancing the autonomy, intelligence, and efficiency of China's semiconductor industry. UNICLOUD stands ready to collaborate with partners across the entire industrial chain to foster a robust ecosystem for domestic chips, injecting strong momentum into technological self-reliance and the development of Digital China.