YMTC 128-layer 1.33Tb QLC 3D NAND flash memory, code named X2-6070, has passed the verification and validation on SSD and other platforms amount a batch of controller vendors. As the first NAND manufacturer to launch the QLC 128-layer 3D NAND flash memory, YMTC achieved the highest bit density, highest I/O speed and highest capacity on single NAND chip with Xtacking architecture.
UNISOC Launches second-generation 5G smartphone platform T7520 which Built on a 6nm EUV process with enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption and Integrated financial-level security.
YMTC unveils its ground-breaking Xtacking® Architecture for 3D NAND at the Flash Memory Summit (FMS), and is awarded the Best of Show of the summit.
Tsinghua Unigroup acquires Linxens, the world’s top chip carrier tape provider, for EUR 2.2 billion.
Tsinghua Unigroup invests RMB 12 billion to enter the public cloud market, successfully launching relevant products for trial commercialization.
The 3D NAND flash chip production plant of YMTC, which has the world’s largest clean room, completes the preparation stage of mass production, and achieves small-scale mass production of 32-layer 3D NAND flash chips.
Yangtze Memory Technologies Co., Ltd. develops China’s own 32-layer 3D NAND flash chip, making a groundbreaking achievement in Chinese memory chips.
Tsinghua Unigroup invests in the Suzhou branch of LITE-ON to acquire its 55% shares for developing memory products including solid state disks.
Tsinghua Unigroup sets up a joint venture – UNIS WDC with Western Digital Corp, in an attempt to enter the field of big data storage.
Tsinghua Unigroup joins forces with a number of partners to establish Yangtze Memory Technologies Co., Ltd.
Tsinghua Unigroup-controlled Unimos Microelectronics (Shanghai) Co., Ltd. begins its layout in the semiconductor packaging and testing industry.
Unisplendour Corporation Limited, a subsidiary of Tsinghua Unigroup, acquired 51% equity of H3C, a giant of network equipment, memory and servers in China. The two parties will combine their advantages to jointly build a leading IT enterprise in China.
Tsinghua Unigroup acquires RDA Microelectronics Inc., a company listed in the U.S., to expand the IoT chip market and strengthen integration and synergy in the integrated circuit industry.
Intel Corporation invests RMB 9 billion in Spreadtrum and RDA, which are already owned by Tsinghua Unigroup. This kicks off the joint development by Intel and Tsinghua Unigroup of mobile phone solutions based on Intel’s architecture and communication technology.
Tsinghua Unigroup acquires Spreadtrum Communications, Inc., a U.S.-listed company, marking the company’s official entry into the integrated circuit chip industry.
In 2009, Tsinghua Unigroup appoints a new management team to lead the group strategy and operations.
In 2010, Tsinghua Unigroup adopts a mixed-ownership structure.
In 2012, Tsinghua Unigroup Chairman Zhao Weiguo launches new goal and development strategy to build a world-class high-tech enterprise.
Tsinghua University Sci-Tech General Company is reorganized into the Tsinghua Unisplendour (Group) Co., Ltd.
In 1988, Tsinghua University establishes Tsinghua University Sci-Tech General Company, later becaming Tsinghua Unigroup.