Wuhan, China, April 13, 2020 - Yangtze Memory Technologies Co., Ltd (YMTC), today announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working with multiple controller partners. As the first QLC based 128-layer 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released flash memory parts in the industry①. Accompanying this release, YMTC introduced a 128-layer 512Gb TLC (3 bit/cell) chip, X2-9060, to meet diversified application requirements.
Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption.
On September 2nd, 2019, right before IC China 2019 opened in Shanghai, Yangtze Memory Technologies Co., Ltd. (YMTC), a subsidiary owned by Tsinghua Unigroup, announced that it would apply Xtacking® 2.0 in its third-generation 3D NAND flash. Tsinghua Unigroup introduced the technical concept...
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