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  • YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND
    YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND

    04/13/2020

    Wuhan, China, April 13, 2020 - Yangtze Memory Technologies Co., Ltd (YMTC), today announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working with multiple controller partners. As the first QLC based 128-layer 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released flash memory parts in the industry①. Accompanying this release, YMTC introduced a 128-layer 512Gb TLC (3 bit/cell) chip, X2-9060, to meet diversified application requirements.

  • BREAKING | UNISOC LAUNCHES NEW-GEN 5G SOC T7520
    BREAKING | UNISOC LAUNCHES NEW-GEN 5G SOC T7520

    02/27/2020

    Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption. 

  • YMTC’s Xtacking® 2.0 Makes Its Debut at IC China 2019
    YMTC’s Xtacking® 2.0 Makes Its Debut at IC China 2019

    10/16/2019

    On September 2nd, 2019, right before IC China 2019 opened in Shanghai, Yangtze Memory Technologies Co., Ltd. (YMTC), a subsidiary owned by Tsinghua Unigroup, announced that it would apply Xtacking® 2.0 in its third-generation 3D NAND flash. Tsinghua Unigroup introduced the technical concept...

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