Source: H3C |Original Link
From July 17 to 20, the 2026 World Artificial Intelligence Conference and the High-Level Meeting on Global Governance of Artificial Intelligence were held in Shanghai. As a leader in digital and AI solutions, H3C Group, a subsidiary of Unisplendor Corporation, made a prominent appearance under the theme of "Achieving Ultimate Token Cost-Effectiveness." The company comprehensively showcased its full-stack collaborative capabilities spanning computing, networking, storage, cloud, security, and operations & maintenance (O&M). Leveraging systematic engineering principles, H3C redefined next-generation AI infrastructure and demonstrated the latest practical achievements in Token operations and applications through a series of innovative experiential showcases, thereby assisting clients in achieving ultimate Token cost-effectiveness.
Full-Stack Collaboration Driving Efficient Token Generation
At the event, H3C presented a comprehensive integrated strategy featuring deep collaboration across its full-stack capabilities in computing, networking, storage, cloud, security, and O&M. This approach advances AI infrastructure from isolated breakthroughs to global optimization, unleashing ultimate computing efficiency.
As a flagship product integrating six core capabilities, the H3C UniPoD S80000 Super Node made a significant debut. Covering a full product lineup ranging from 32 to 1,024 cards, it supports elastic scaling up to 16,384 cards. It delivers a 70% increase in training performance and a threefold improvement in inference performance, providing full-scenario support for large model training, inference, and industry intelligence.
As the core solution embodying the full-stack capabilities of computing, networking, storage, cloud, security, and O&M, the H3C Lingxi Intelligent Computing Solution is not merely an accumulation of products. Instead, it relies on breakthrough innovations in key technologies such as optical interconnection, computing-network collaboration, liquid cooling, high-density architecture design, and topology optimization. Through full-stack software-hardware collaborative tuning, it achieves a reduction of over 30% in total cost of ownership (TCO) across the entire link and a decrease of more than 40% in energy costs, effectively lowering Token production costs. Currently, this solution has been deployed at scale in scenarios including government cloud training and inference platforms, intelligent computing centers for large-scale model training, and medical research AI applications.
Meanwhile, core products of the intelligent computing solution were fully exhibited. In terms of diversified computing power, a computing product matrix tailored for the AI era was displayed, featuring high-density fully liquid-cooled systems and multiple flagship servers for training and inference. Regarding intelligent computing networks, H3C showcased a full series of single-chip 102.4T intelligent computing switches and next-generation intelligent computing WAN products. Relying on core technological innovations in three key areas—optical-electrical parallelism, computing-network tuning, and lossless wide-area transmission—these products effectively resolve efficiency bottlenecks in multi-tier computing interconnections, providing a robust network foundation for high-concurrency, high-throughput intelligent computing workloads. For high-performance storage, the newly launched AI-native storage and XCache inference acceleration engine significantly reduce GPU training wait times, offering stable, efficient, and cost-effective core storage support for AI workloads.
At the cloud platform level, H3C Intelligent Cloud leverages three core capabilities—an integrated general-intelligent architecture, an intelligent computing acceleration engine, and a data-intelligence converged MaaS platform—to build a unified, efficient, stable, trusted, and open cloud-data-intelligence platform. In AI security, the newly upgraded AI-driven proactive security system establishes a complete closed loop covering intelligent detection, autonomous operations, and end-to-end protection for AI services. In intelligent O&M, the H3C Lingxi O&M Agent demonstrated onsite at WAIC how to comprehensively perceive the operational status of full-stack equipment, making O&M more efficient and manageable.
Making the Value of Tokens Visible, Tangible, and Perceptible
H3C serves not only as a foundational builder in the AI era but also as a dedicated enabler of AI implementation. The exhibition zone featured multiple innovative application experience areas that highlighted the latest practical outcomes in Token operations and applications. Visitors gained firsthand insight into how H3C, driven by the dual engines of "Turing Town" and "Chip-Model Community," is pioneering an innovative AI industrial model encompassing computing power supply, technology verification, industrial incubation, and Token operations.
As a core technical support entity for the Turing Pilot Site, H3C assisted Hangzhou in establishing the industry's first chip-model integrated pilot site. At this exhibition, the Turing Pilot Platform was brought onsite for the first time, allowing visitors to personally experience the entire process from chip-model adaptation to performance tuning. This provided a tangible demonstration of how chips and models achieve collaborative optimization, converting theoretical computing power into real-world AI productivity.
In industry applications, supported by its end-to-end private domain Agent solution, H3C has deeply integrated agent technology with industry-specific scenarios. Key implementations include a provincial-level full-link bidding supervision system for a government ministry, an AI IoT traffic card full lifecycle management system for the power and energy sector, and an intelligent procurement full-process management system for state-owned enterprises, helping clients realize a closed loop of AI implementation value.
Furthermore, numerous new solutions and products—including AI+Government, AI+Enterprise, AI+Healthcare, and AI Workstations—were showcased to demonstrate their practical deployment, addressing the question of "how Tokens generate industry value" through real-world cases. Notably, the "Interactive Experience of Traditional Chinese Medicine Four Diagnostic Methods," developed jointly by H3C and Qihuang Digital Technology, attracted significant attention. Many visitors stopped to experience the sophisticated capabilities of the "AI Doctor" through the traditional diagnostic methods of observation, auscultation/olfaction, inquiry, and palpation.
In addition, guided by the Office of the Organizing Committee of the World Artificial Intelligence Conference and co-hosted by the Artificial Intelligence Industry Working Committee of the China Computer Industry Association, Shanghai Zhangjiang Hi-Tech Park Development Co., Ltd., and H3C Group, the "AI Computing Power Technology Architecture Innovation Forum" will also be held on July 18 at the Shanghai World Expo Center. At that time, numerous authoritative domestic standards organizations, mainstream domestic chip enterprises, leading internet companies, renowned system vendors, and industry partners will engage in in-depth exchanges on the aforementioned industrial topics. Together, they will explore cutting-edge architectures for the efficient collaboration of heterogeneous computing power and discuss how to genuinely enhance computing efficiency through open interconnection and ecosystem adaptation, thereby maximizing the cost-performance ratio of tokens.
As global attention turns once again to Shanghai, H3C is leveraging its full-stack capabilities to redefine the efficiency boundaries of AI infrastructure. H3C will continue to rely on its full-stack collaborative capabilities spanning computing, networking, storage, cloud, security, and operations to maximize the cost-performance ratio of tokens and accelerate the intelligent transformation across all industries.